PSM Plasma Systems is global leader plasma technology for Semiconductor, PCB, LCD and Material industries.
We PSM Inc. has rich experience and excellent staffs who have developed and commercialized various highly evaluated optimized processing techniques and practical manufacturing systems which are related to Semiconductor & Display industry, PCB & FCCL industry and other polymer industries over 10 years in the Institute for Advanced Engineering.
This is indeed useful technique that is able to improve productivity and quality simultaneously not only for semiconductor/displays/electronic parts, but for low-temperature material industry such as polymer & plastic / FPCB & FCCL by a possible in-line process. We PSM Inc. are expanding and thriving based on the diverse world-leading essential patents of atmospheric pressure plasma techniques throughout the following four areas: semiconductor packaging/display dry cleaning/polymer materials, surface treatments /environmental system; furthermore, our technology has acquired a reputation in a wide range of areas. The atmospheric pressure plasma technique is a new advanced plasma system, which can overcome the limit of existing low-pressure vacuum plasma technique.
The surface cleaning and treatment system using atmospheric pressure plasma (APP) is widely expanded in various display manufacturing process like TFT-LCD, PDP, OLED, solar cell as a new alternative of EUV system. surface cleaning treatment system product
PSM APP system can support excellent cost effective processing as well as its convenient installation and operation with conventional wet cleaning system.
Basically it also assists to raise up performance and production yield by removing surface organic contaminations and improving surface wetting & adhesion property.
PSM APP system can be supplied console type including conveyor parts and controller as well as module type adding on wet in-line equipment.
Especially LCM line, console type APP make easily possible to attach before main equipments something like ACF and COG bonding machine for removing organic contaminations and improving adhesion property. Flat Panel display manufacturer
The nitrogen usage of PSM APP is convinced of very lower degree than any other competitors by patented new developed electrode design. Besides in case of under the 400mm glass size, new remote type APP system using just air only can be provided. That is technical breakthrough in AP plasma field because of eliminating high cost pure nitrogen gas.
• Effective Cleaning for OLED Glass
• Surface Treatment of ACF Bonding Pad